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Engineering Plastic

LCP (30% Glass-Filled)

LCP with 30% glass fill is a liquid-crystal-polymer rated to 240C with exceptional melt flow, very low thermal expansion, and tight dimensional stability. Strong (135 MPa) but brittle (2% elongation) and fully chemically resistant, its ability to fill thin sections and hold dimensions through reflow soldering makes it the connector material of choice in electronics.

How LCP (30% Glass-Filled) machines

Rated 2.5/5 — the glass fill is abrasive and demands sharp carbide tooling, and LCP's anisotropic, fibrous structure can splinter at edges. Most LCP parts are molded, not machined, but where CNC is used take light cuts with sharp edges and plan for tool wear from the glass and the polymer's own stiff fiber-like morphology.

Manufacturing & processing

Primarily injection molding, with CNC for limited prototype work. Its very high melt flow fills extremely thin walls and fine features that other plastics cannot, enabling miniaturized connectors. Low, predictable shrinkage and low CTE let molded parts survive surface-mount reflow soldering without warping — a defining processing advantage.

Typical applications

Best for thin-wall electronic connectors, sockets, and surface-mount components that pass through reflow soldering. The combination of high-temperature stability, low thermal expansion, and the flow needed to mold tiny features is what makes LCP-GF dominant in fine-pitch connector housings and miniature electronic hardware.

When to choose it

Choose LCP-GF when you need thin-wall moldability, dimensional stability through reflow, and 240C service in one material — connectors and miniature electronics are the sweet spot. Choose a tougher plastic where impact matters, since 2% elongation makes LCP brittle. Avoid it for parts requiring extensive machining or flex.

Suitable surface finishes

Common finishes for LCP (30% Glass-Filled): bead blasting, powder coating. Use the finish selector →

FAQ

Why is LCP used for electronic connectors?
LCP combines exceptional melt flow to fill very thin connector walls, low thermal expansion, and 240C stability so molded parts survive reflow soldering without warping. That trio of moldability, dimensional stability, and heat resistance is hard to match, making it the standard for fine-pitch, surface-mount connector housings.
Is LCP brittle?
Yes — at 2% elongation, glass-filled LCP is brittle and intolerant of impact or flexing. Its strength is rigidity and dimensional stability, not toughness. Use it for rigid molded housings and connectors that stay still; choose a tougher engineering plastic for parts that take shock or repeated bending.
Can LCP-GF survive reflow soldering?
Yes — its 240C service rating, low thermal expansion, and dimensional stability let molded LCP connectors pass through surface-mount reflow ovens without warping or losing tolerance. This reflow survivability is a key reason it is specified over lower-temperature plastics for solder-mounted electronic components.

Property values are typical/nominal for early guidance and vary by temper, grade, supplier and heat treatment. Confirm critical specs against a certified datasheet or with an mfgiq engineer.